201058-08-4 | WANG RESIN - Chemical Cloud Database

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Molecular Structure:

CAS No.: 201058-08-4 ;65307-53-1

Product Name.:

CCD No.:CCD00063337

Formula:

MolWeight:0.0

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Basic Information
Product Name：	WANG RESIN
CAS：	201058-08-4 ;65307-53-1
English Synonyms：	4-BENZYLOXYBENZYL ALCOHOL ON POLYSTYRENE ; 4-BENZYLOXYBENZYL ALCOHOL RESIN ; P-ALKOXYBENZYL ALCOHOL, POLYMER-BOUND ; POLYSTYRENE PHB ; BENZYLOXYBENZYL ALCOHOL ON POLYSTYRENE ; WANG CHEMMATRIX(R) RESIN ; WANG PS RESIN ; P-BENZYLOXYBENZYL ALCOHOL RESIN ; NOVASYN(R) TG HMP RESIN ; [4-(HYDROXYMETHYL)PHENOXYMETHYL]POLYSTYRENE ; HMP RESIN VHL ; STRATOSPHERES(TM) PL-WANG RESIN ; WANG'S RESIN ; 4-ALKOXYBENZYL ALCOHOL RESIN ; 4-HYDROXYMETHYLPHENOXYACETYL-4'-METHYLBENZYHYDRYLAMINE RESIN ; WANG RESIN VHL ; 4-HOCH2-PH-O-CH2-PH-POLYMER ; P-BENZYLOXYBENZYL ALCOHOL RESIN VHL ; WANG ALCOHOL RESIN ; NOVASYN TG HMP RESIN ; HMP RESIN ; 4-HYDROMETHYLPHENOXYACETIC ACID AM RESIN ; 4-HYDROXYMETHYL-PHENOXY CHEMMATRIX RESIN ; WANG RESIN LL ; 4-BENZYLOXYBENZYL ALCOHOL, POLYMER-BOUND ; 4-(HYDROXYMETHYL)PHENOXYMETHYL POLYSTYRENE RESIN ; 4-BENZYLOXYBENZYL ALCOHOL, POLYMER SUPPORTED ; P-METHOXYBENZYL ALCOHOL RESIN ; 4-BENZYLOXYBENZYL ALCOHOL POLYSTYRENE ; WANG RESIN ; P-ALKOXYBENZYL ALCOHOL RESIN ; 4-BAP
MDL Number.：	MFCD00131778
H bond acceptor：	0
H bond donor：	0
InChi：	InChI=1S//
InChiKey：	InChIKey=MOSFIJXAXDLOML-UHFFFAOYSA-N
Property
Comments：	LEGAL INFORMATION: CHEMMATRIX IS A REGISTERED TRADEMARK OF MATRIX INNOVATION, INC PARTICLE SIZE: 35-100 MESH STORAGE TEMPERATURE: 2-8 DEG C UNSPSC: 12352100 WGK: 3
Information：	CAPACITY: 0.5-1.2 MMOL/G LOADING
Safety information
WGK Germany：	3

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