POLYSULFONE ,25154-01-2 _Chemical Cloud Database

POLYSULFONE

Basic Information
Product Name：	POLYSULFONE
CAS：	25154-01-2 ;25135-51-7
English Synonyms：	POLYSULFONE RESIN ; SULFONE RESIN ; POLYSULFONE
MDL Number.：	MFCD00134387
H bond acceptor：	12
H bond donor：	0
Smile：	c1ccc(cc1)C(C)(C)c2ccc(cc2)Oc3ccc(cc3)S(=O)(=O)c4ccc(cc4)Oc5ccc(cc5)C(C)(C)c6ccc(cc6)Oc7ccc(cc7)S(=O)(=O)c8ccc(cc8)Oc9ccc(cc9)C(C)(C)c1ccc(cc1)Oc1ccc(cc1)S(=O)(=O)c1ccc(cc1)O
InChiKey：	InChIKey=null
Property
Density：	DENSITY: 1.24 G/ML AT 25 DEG C(LIT)
Physical Property：	AUTOIGNITION TEMPERATURE: 1022 DEG F REFRACTIVE INDEX: N20/D 1.633 TRANSITION TEMPERATURE: TG 190 DEG C
Comments：	APPLICATION: MICROWAVE COOKWARE, APPLIANCE COVERS, SURGICAL TOOLS, AUTOMOTIVE ELECTRICAL COMPONENTS, PRINTED CIRCUIT BOARDS AND PLUMBING COMPONENTS FEATURES AND BENEFITS: HIGH IMPACT RESISTANCE. TEMPERATURE USE RANGE UP TO 160 DEG C. EXCEPTIONAL STEAM STERILIZATION STABILITY. ELECTRICAL PROPERTIES ARE MAINTAINED OVER A WIDE TEMPERATURE AND FREQUENCY RANGE. HIGH RESISTANCE TO RADIATION DEGRADATION FORM: BEADS FORM: PELLETS HARDNESS: 69 (ROCKWELL M, ASTM D 785) MELT INDEX: 6.5 G/10 MIN (343 DEG C/2.16 KG, ASTM D1238) PHYSICAL FORM: AMORPHOUS THERMOPLASTIC REDUCED VISCOSITY: 0.43-0.46 DL/G, 0.2 % (W/V) IN CHLOROFORM(25 DEG C)(LIT) UNSPSC: 12162002 WGK: 3
Information：	MW: AVERAGE MN APPROX 22,000 BY MO
Safety information

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