Basic Information |
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| Product Name： | FILLING SOLUTION |
| English Synonyms： | FILLING SOLUTION ; COMBINATION ISE FILLING SOLUTION |
| MDL Number.： | MFCD00283233 |
| H bond acceptor： | 0 |
| H bond donor： | 0 |
| InChi： | InChI=1S// |
| InChiKey： | InChIKey=MOSFIJXAXDLOML-UHFFFAOYSA-N |
Property |
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| Boiling Point： | 106 DEG C/750 MMHG |
| Density： | DENSITY: 1.12 G/ML AT 25 DEG C |
| Comments： | FOR REFERENCE AG/AGCL ELECTRODE (30% KCL/TRACE AGCL) GENERAL DESCRIPTION: VISIT OUR SENSOR APPLICATIONS PORTAL TO LEARN MORE WGK: 1 |
Safety information |
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