Basic Information |
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| Product Name： | FMOC-THR(TBU)-WANG RESIN |
| CAS： | 42074-68-0 ;9003-70-7 |
| English Synonyms： | FMOC-THR(TBU)-HMP RESIN ; FMOC-L-THR(TBU)-RINK MBHA RESIN ; FMOC-THR(TBU)-RINK AMIDE-MBHA RESIN ; N-ALPHA-FMOC-O-T-BUTYL-L-THREONINE-HMP-TENTAGEL RESIN ; N-ALPHA-FMOC-O-T-BUTYL-L-THREONINE-HMP RESIN ; N-ALPHA-(9-FLUORENYLMETHOXYCARBONYL)-O-(T-BUTYL)-L-THREONINE P-METHOXYBENZYL ALCOHOL RESIN ; N-ALPHA-(9-FLUORENYLMETHOXYCARBONYL)-O-(T-BUTYL ETHER)-L-THREONINE P-BENZYLOXYBENZYL ALCOHOL RESIN ; FMOC-THR(TBU)-WANG RESIN ; FMOC-O-TERT-BUTYL-L-THREONINE 4-BENZYLOXYBENZYL ESTER POLYMER-BOUND ; FMOC-THR(TBU)-HMP-TENTAGEL RESIN ; FMOC-L-THR(TBU)-4MBH RESIN ; FMOC-THR(TBU)-WANG RESIN LL ; FMOC-THR(TBU)-NOVASYN(R) TGA ; N-ALPHA-FMOC-O-T-BUTYL-L-THREONINE-RINK AMIDE-MBHA RESIN ; TENTAGEL(TM) S PHB-THR(T-BU)FMOC ; FMOC-L-THR(TBU)-4-METHOXYBENZHYDRYL RESIN ; FMOC-O-TERT-BUTYL-L-THREONINE 4-[POLY(OXYETHYLENE)CARBAMOYL]TRITYL ESTER POLYMER-BOUND ; FMOC-THR(TBU)-P-ALKOXYBENZYL ALCOHOL RESIN ; FMOC-THR(TBU)-SASRIN(TM) RESIN ; FMOC-L-THREONINE(O-T-BUTYL) RESIN ESTER ; FMOC-THR(TBU)-WANG PS RESIN ; FMOC-L-THR(TBU)-WANG TENTAGEL S ; FMOC-L-THR(TBU)-OL-2CT RESIN ; FMOC-L-THR(TBU)-OL-2-CHLOROTRITYL RESIN ; N-ALPHA-FMOC-O-T-BUTYL-L-THREONINE-ETHYLAMIDE-SIEBER RESIN ; FMOC-THR(OTBU)-WANG RESIN ; TENTAGEL S PHB-L-THR(TBU)FMOC ; FMOC-THR(TBU)-NOVASYN(R) TGT ; FMOC-THR(TBU)-NOVASYN TGA ; FMOC-L-THR(TBU)-RINKAMIDE MBHA RESIN ; FMOC-L-THR(TBU)-4-METHYLBENZHYDRYL RESIN ; TENTAGEL(TM) S TRT-THR(T-BU)FMOC ; FMOC-THR(TBU)-ALKO RESIN ; FMOC-THR(BUT)-WANG RESIN ; FMOC-L-THR(TBU)-4MEOBH RESIN ; FMOC-O-TERT-BUTYL-L-THREONINE 4-[POLY(ETHYLENOXY)]BENZYL ESTER POLYMER-BOUND ; FMOC-L-THR(TBU)-MPPA(WANG) RESIN ; FMOC-THR(TBU)-RINK RESIN ; FMOC-L-THR(TBU)-WANG TG ; FMOC-THR(TBU)-ETHYLAMIDE-SIEBER RESIN ; N-ALPHA-FMOC-O-T-BUTYL-L-THREONINE-WANG RESIN ; FMOC-L-THR(TBU)-WANG RESIN ; FMOC-L-THR(TBU)-WANG ; FMOC-THR(TBU)-RESIN ; FMOC-O-TERT-BUTYL-L-THREONINE 4-ALKOXYBENZYL ALCOHOL RESIN |
| MDL Number.： | MFCD00801268 |
| H bond acceptor： | 5 |
| H bond donor： | 1 |
| Smile： | *C(=O)[C@H]([C@@H](C)OC(C)(C)C)NC(=O)OCC1c2ccccc2-c3c1cccc3 |
| InChiKey： | InChIKey=null |
Property |
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| Comments： | PARTICLE SIZE: 100-200 MESH STORAGE TEMPERATURE: 2-8 DEG C UNSPSC: 12352100 WGK: 3 |
| Information： | EXTENT OF LABELING: 0.4-0.6 MMOL/G LOADING MATRIX: POLYSTYRENE, CROSSLINKED WITH 1% DVB |
Safety information |
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| WGK Germany： | 3 |
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