Basic Information |
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| Product Name： | POLYIMIDE RESIN |
| CAS： | 62929-02-6 |
| English Synonyms： | POLYIMIDE RESIN ; POLYIMIDE |
| MDL Number.： | MFCD01868102 |
| H bond acceptor： | 0 |
| H bond donor： | 0 |
| InChi： | InChI=1S// |
| InChiKey： | InChIKey=MOSFIJXAXDLOML-UHFFFAOYSA-N |
Property |
|
| Melting Point： | >300 DEG C |
| Density： | DENSITY: 1.2 |
| Physical Property： | FLASHPOINT: >93 DEG C (199 DEG F) |
| Comments： | HAZARD: R 36/37/38 HAZARD: S 26-37-60 IRRITANT TSCA: Y UNSPSC: 12352001 |
Safety information |
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