TITANIUM ETCH_Chemical Cloud Database

TITANIUM ETCH

Basic Information
Product Name：	TITANIUM ETCH
English Synonyms：	TITANIUM ETCHANT ; TITANIUM ETCH
MDL Number.：	MFCD08705364
H bond acceptor：	0
H bond donor：	0
InChi：	InChI=1S//
InChiKey：	InChIKey=MOSFIJXAXDLOML-UHFFFAOYSA-N
Property
Melting Point：	-35 DEG C
Boiling Point：	200 DEG C
Physical Property：	VAPOR PRESSURE: 14 MMHG (20 DEG C)
Comments：	APPLICATION: DESIGNED FOR ETCHING EVAPORATED FILMS COMMONLY EMPLOYED AS BONDING AND BARRIER LAYERS IN MICROELECTRONICS. EXCELLENT RESOLUTION, PHOTO RESIST COMPATIBILITY, AND MINIMAL UNDERCUTTING ARE READILY ACHIEVED FEATURES AND BENEFITS: USE WITH POLYETHYLENE TANKS BETWEEN 20-50 DEG C. ETCH RATES 25ANGSTROM/SEC AT 20 DEG C, 50ANGSTROM/SEC AT 30 DEG C. RINSE WITH DI WATER RIDADR: UN 1790 8/PG 2 UNSPSC: 12352300 WGK: 2
Safety information

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