TUNGSTEN ETCH_Chemical Cloud Database

TUNGSTEN ETCH

Basic Information
Product Name：	TUNGSTEN ETCH
English Synonyms：	TUNGSTEN ETCHANT ; TUNGSTEN ETCH
MDL Number.：	MFCD08705365
H bond acceptor：	0
H bond donor：	0
InChi：	InChI=1S//
InChiKey：	InChIKey=MOSFIJXAXDLOML-UHFFFAOYSA-N
Property
Comments：	APPLICATION: SELECTIVE ETCHANTS FOR TUNGSTEN THIN-FILM METALLIZATIONS USED IN SEMICONDUCTOR AND MICROELECTRONICS TECHNOLOGY. ETCHANTS ARE BUFFERED, MILDLY ALKALINE FERRICYANIDE-BASED FORMULATIONS PROVIDING HIGH RESOLUTION PATTERNS WITH MINIMAL UNDERCUTTING AND PHOTORESIST COMPATIBILITY. CONTROLLED, UNIFORM ETCHING IS ACHIEVED BY IMMERSION OR SPRAY ETCH TECHNIQUE FEATURES AND BENEFITS: ETCH RATE (IMMERSION)20 DEG C 30ANGSTROM/SEC,30 DEG C 140ANGSTROM/SEC, 60 DEG C 250ANGSTROM/SEC, RINSE WITH DI WATER RIDADR: UN 3266 8/PG 3 UNSPSC: 12352300 WGK: 2
Safety information

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