Molecular Structure:
CCD No.:CCD00388051
WANG-AMIDE RESIN
Formula:
MolWeight:0.0
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| Product Name： | WANG-AMIDE RESIN |
| English Synonyms： | 4-BENZYLOXYBENZYLAMINE, POLYMER-BOUND ; HYDROXYLAMINE, POLYMER-BOUND ON WANG RESIN ; WANG-AMIDE RESIN ; 4-BENZYLOXYBENZYL AMINE POLYSTYRENE |
| MDL Number.： | MFCD03454176 |
| H bond acceptor： | 0 |
| H bond donor： | 0 |
| InChi： | InChI=1S// |
| InChiKey： | InChIKey=MOSFIJXAXDLOML-UHFFFAOYSA-N |
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| Comments： | PARTICLE SIZE: 100-200 MESH UNSPSC: 12352100 WGK: 3 |
| Information： | CROSSLINKING: 1 % CROSS-LINKED WITH DIVINYLBENZENE EXTENT OF LABELING: 0.5-1.3 MMOL/G LOADING |
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| WGK Germany： | 3 |
Basic Information
* If the product has intellectual property rights, a license granted is must or contact us.
